Sign In | Join Free | My peerflix.com
peerflix.com
More Super Hard Products Co., Ltd
More Super Hard Products Co., Ltd
Home > grinding wheel >

1A8 Resin bond super thin diamond dicing blades, cutting bladefor camera

More Super Hard Products Co., Ltd
More Super Hard Products Co., Ltd
Country/Region: China

1A8 Resin bond super thin diamond dicing blades, cutting bladefor camera

Brand Name : more
Model Number : more types
Certification : iso9001:2008
Place of Origin : china
MOQ : 1
Price : 1-10
Payment Terms : D/P, Western Union, MoneyGram
Supply Ability : 3000/months
Packaging Details : carton box
material : diamond
Contact Now

Diamond Dicing Blades

diamond dicing blades

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

The Type: diamond hub dicing blade and diamond hubless dicing blade


Electroformed diamond hub dicing blade

Electroformed dicing

blade

Features:

Easy to handle ultra-thin blade; Blade dicing

after laser grooving; Variety of different grit

concentrations; Shows stable processing

performance in high load processing


Hub dicing blade

Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

resin dicing blade


resin dicing blade

Features:

High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials


Hubless dicing

blade

Application:

Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

metal dicing blade


metal dicing balde

Features:

High rigidityminimized wavy and slant cutti

g ; Able to control diamond concentration to

achieve cutting quality ;Excellent rigidit and

cut quality

Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,

Electroformed dicing balde

Electroformed dicing

balde

Features:

Wide selection of blade options; Proprietary

thin-blade technology ;Blade thickness - 0.0

15 mm to 0.3 mm; Available for both dicing

saws and slicers

Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Other specification can be produced according to customer’s requirements anna.wang@moresuperhard.com

China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

1A8 Resin bond super thin diamond dicing blades, cutting bladefor camera Images

Inquiry Cart 0
Send your message to this supplier
 
From:
Enter your email please.
To: More Super Hard Products Co., Ltd
Subject:
Message:
Characters Remaining: (0/3000)